Abstract: In this paper, a low-power MEMS two-dimensional (2-D) thermal wind sensor with high reliability is presented. The sensor is based on a glass-in-silicon reflow process. The embedded vertical ...
Abstract: We report a solder-reflow-compatible thermoplastic material that can be deployed in co-packaged optical assemblies with no dimensional change of the material up to $269~^{\circ }$ C. We ...
HANMI Semiconductor ranked No. 1 in market share for high bandwidth memory (HBM) TC bonders in the third quarter of this year, according to a survey. According to the "2025 TC bonder market report for ...
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