Chemical fingerprinting: The technology detects unique volatile organic compounds each mold species emits, creating distinct “odor signatures” the sensors can recognize 30-minute detection: The device ...

Abstract: This paper presents a study on Epoxy Mold Compounds (EMC) used as encapsulant in Quad Flat No-lead (QFN) packages. The goal is to characterize the behaviour of the two different EMCs during ...

Abstract: In FOWLP/FOPLP warpage and die shift can still cause issues affecting handling as well as the accuracy of downstream processes. State-of-the-art liquid mold compounds are highly filled to ...

The semiconductor industry’s push into 3D integration and large-format substrates has fundamentally changed the role of materials in packaging. What were once structural supports and electrical ...