Abstract: The increasing complexity of software projects makes it difficult to predict risks in software requirements, which is a crucial and essential part of the Software Development Life Cycle ...
Abstract: In this paper, we explore the design considerations of two approaches to 2.5-D integration (silicon interposer and bridge-chip) from a thermal perspective and compare to 3-D ICs. Moreover, ...
The China International Conference on Basic Education (CICBE) 2025 commenced in Shanghai on Saturday, bringing together nearly 400 participants from around the globe to explore the integration of ...
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