Femme Flora, a Nigerian women’s wellness and beauty brand, has reaffirmed its commitment to promoting natural, holistic self-care while expanding its reach in the wellness industry. Speaking on behalf ...
Legendary actress Kathleen Turner made a dazzling return to the red carpet this week to support the Citymeals on Wheels charity gala in New York. At 71, the Hollywood legend remains one of the ...
Over on Hackaday.IO our hacker [bornach] has his entry into the Component Abuse Challenge: Inductors are Wireless Power Sources. Some time back [bornach] was gifted a Qi wireless charging base station ...
We’re living through an era of accelerated change, and leaders feel it every day. In five years, we’ve experienced the impacts of Covid and how it rebooted the norms we took for granted in how we work ...
SANTA CLARA, California - Sept 24 (Reuters) - The computing chips that power artificial intelligence consume a lot of electricity. On Wednesday, the world's biggest manufacturer of those chips showed ...
According to Bourns, its Model SRP1024HMCT Shielded Power Inductors are manufactured using a hot press molding process with carbonyl powder. Thus, they offer multiple benefits, including high heating ...
Section 1. Purpose and Policy. America has long led the world in innovation, technological advancement, and design. But with a sprawling ecosystem of digital services offered to Americans, the ...
Experts at the Table: Semiconductor Engineering sat down to discuss how and where AI can be applied to chip design to maximize its value, and how that will impact the design process, with Chuck Alpert ...
The SEPIC is a non-isolated switching power supply topology capable of producing output voltages above, below, or equal to the input. The SEPIC topology, a non-isolated switching power supply, is ...
The SRF1209U4 series of common-mode chip inductors developed by Bourns Inc. is designed for noise suppression in signal transmission-line applications. They feature a low-profile, compact footprint ...
AI software innovation is accelerating, while the chip design process is struggling to keep pace due to rising complexity and physical constraints. The big challenge now is how to close that gap. The ...
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