As such, Roumen doesn't hold back on the software he's happy to embrace, which includes the works all the best 3D modelling ...
Abstract: An innovative 3D stackable wing-shaped Via RRAM is firstly proposed, featuring logic embedded ultra-high memory density (>0.1Gb/mm 2) and full compatibility with TSMC’s 16nm FinFET CMOS ...
Abstract: An advanced micromachining process has been developed to further push the performance limits of mass-produced inertial MEMS. The main achievement of the new platform technology is the usage ...
At CES 2026, Avatar Medical is giving consumers a rare look at how the medical exam room is about to change. The company will ...