Packaging Gateway on MSN

Burgopak designs dual-slide bank card packaging for Emerge

Burgopak has partnered with card manufacturer Placard to design a dual-slide bank card packaging format for fintech company ...

Craters & Freighters Transforms Hazmat Shipping Operations with DGIS Software to Support Compliance Across 30+ Locations

Craters & Freighters strengthens compliant dangerous goods shipping across 30+ locations using DGIS software to ...
Packaging Europe

PepsiCo teams up with Siemens and NVIDIA on AI and digital twin technology

PepsiCo has announced a multi-year collaboration with Siemens and NVIDIA, aiming to transform its plant and supply chain ...

Machine Vision Camera Market worth $10.19 billion by 2030 - Exclusive Report by MarketsandMarkets™

According to MarketsandMarkets™, the Machine Vision Camera Market is expected to grow from USD 6.73 billion in 2025 to USD 10 ...
Semiconductor Engineering

3D-IC Success Stories: Faster Bandwidth, Lower Power, On-Time Tapeouts

Manufacturing-aware system design treats dies, interposers, packages, and analysis as a single, coherent system.
Semiconductor Engineering

Thermal-Mechanical Optimization of 2.5D Flip-Chip Packages With Glass and Silicon Interposers (Univ. of Ottawa)

A new technical paper titled “Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via ...
Le Lézard

QuantalRF CPL Antenna Models Added to Synopsys Simulation Component Libraries

CES ? QuantalRF, the pioneering developer of RF semiconductor and antenna solutions, today announced its DockOn® antennas are now available in Ansys HFSStm high frequency electromagnetic software ...

GSME Secures $35M Series B Funding

GS Microelectronics U.S., Inc. (GSME) today announced a $35 million Series B round led by Maverick Silicon to expand its semiconductor services platform across advanced packaging, design enablement, ...