Abstract: In this article, a multiphysics modeling methodology is presented for predicting the acoustic noise induced by a multilayer ceramic capacitor (MLCC) in mobile electronic devices. The ...

RF front ends are advancing through the integration of high-frequency passive networks with increasingly efficient active devices engineered for ultra-wide bandwidths and constrained power envelopes.

When we think of assembling a PCB, we’re almost always thinking about solder. Whether in paste form or on the spool, hand-iron or reflow, some molten metal is usually in the cards. [Stephen Hawes] is ...

Abstract: The double pulse test (DPT) configuration plays a critical role in the dynamic characterization of SiC MOSFETs due to their high dv/dt and di/dt rates. This paper investigates the impact of ...