The new high-performance modules deliver up to 180 TOPS of power-efficient computation designed for next-level AI ...
KEY POINTS ProArt GoPro Edition (PX13): 13' convertible designed in partnership with GoPro has built-in GoPro Cloud access and exclusive offers ...
Intel launches Core Ultra Series 3 "Panther Lake" mobile chips, promising big gains in CPU, graphics, and efficiency ...
Framework, the biggest player in the modular laptop space right now, took its time to actually get modular gaming parts, and ...
Abstract: The increasing size of package substrates presents various challenges, for which glass core substrates are considered a potential solution. The conventional process (CP) for manufacturing ...
Intel's 14A process node and die-stacking EMIB are the favoured technologies. When you purchase through links on our site, we may earn an affiliate commission. Here’s how it works. If anyone has been ...
Advanced packaging is no longer operating behind the scenes. The technology of advanced packaging is helping to sustain the speed of the semiconductor industry’s improvement in power and performance, ...
Abstract: The increasing demand for high-performance computing (HPC) has driven processor designs toward chiplets integration and ASIC-HBM architectures using high density interconnection technology.
WESTFORD, MA, USA, September 4, 2025 – Zuken Inc. (President:Katsube Jinya, hereinafter “Zuken”) has joined "JOINT3" consortium to develop next-generation semiconductor packaging. JOINT3 is a ...
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