Abstract: Flip-chip assembly of tin-silver-based microbumps is considered today as a reference process in advanced 3D-packaging heterogeneous integration. Two main paths can be followed in order to ...

Abstract: We report a solder-reflow-compatible thermoplastic material that can be deployed in co-packaged optical assemblies with no dimensional change of the material up to $269~^{\circ }$ C. We ...

The C++ interface provides low level access to the native components of Kompute, enabling for advanced optimizations as well as extension of components. The Python package provides a high level ...

This tool reflows comments in KDoc; either on a file or recursively over nested folders, as well as an IntelliJ IDE plugin where you can reflow the current comment around the cursor. Here's an example ...

Extreme heat and flux vapours destroy conventional oils. Learn how high temperature lubrication protects reflow chains and keeps SMT lines running longer. In modern SMT manufacturing, reflow ovens ...