The lower fuselage half of the Multifunctional Fuselage Demonstrator (MFFD) being assembled at SAM|XL, shown here with conduction-welded stringers and ultrasonic spot-welded clips. Photo Credit: ...
A new technical paper titled “Ammonia Plasma Surface Treatment for Enhanced Cu–Cu Bonding Reliability for Advanced Packaging Interconnection” was published by researchers at Myongji University. “With ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback