Plus, agentic EDA and AI-generated analog layout, small chip fabs, diamond-based defect inspection, large-area nanoimprint ...

Because in the age of AI, performance is no longer determined by a single chip itself. It is shaped by how efficiently the ...

The shift from software-defined to AI-defined vehicles raises questions about whether the hardware can keep up.

Moores Lab AI is betting that chip design AI will only work if it is built around deep semiconductor expertise, not generic ...

As models evolve faster than silicon cycles, chip architects must balance flexible compute, data movement, and ...

Researchers at Carl Zeiss SMT and ASML published a technical paper titled “Hyper-NA: a system with a numerical aperture of at least 0.75.” The researchers examine Hyper-NA EUV lithography with a ...

Low-contact-resistance WSe₂ transistors; backside clock meshes for 2nm GAAFETs; row-parallel processing in DRAM; HBF for high-throughput LLM serving; formal security analysis of CAN XL; abstraction ...

Researchers at ETH Zürich, CISPA, and New York University published a technical paper titled “Terracotta: Enabling the ...

How complementary inspection and metrology techniques can detect smaller defects and distinguish among a wide range of defect types within a unified workflow.

Increasing power density makes heat, stress, and aging harder to predict, and more critical to address earlier in the design flow.

Test vendors are adapting to changing connector architectures and extreme alignment tolerances as co-packaged optics heads ...