Microsemi Corporation introduced the industry's smallest hermetic surface mount package for power transistors and diodes. Microsemi pioneered the development of the new industry-standard U4 package, ...
IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...
The compact U4 is 70 percent smaller than its U3 predecessor and available now exclusively from Microsemi. The package is constructed with aluminum nitride ceramic, which provides excellent heat ...
Two small-signal transistors, the CMBT3904E (NPN) and CMBT3906E (PNP), come housed in the space saving SOT-923 surface-mount package. Both devices are 40-V general purpose transistors with a maximum ...
GOLETA, Calif.--(BUSINESS WIRE)--Transphorm, Inc. (Nasdaq: TGAN)—a pioneer in and global supplier of high reliability, high performance gallium nitride (GaN) power conversion products—today announced ...
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