Flip Electronics and Ampleon continue to extend the supply of Ampleon's Legacy LDMOS portfolio of high-performance RF transistors to customers worldwide. With dedicated capacity and sustained wafer, ...
ALPHARETTA, Ga., Nov. 4, 2024 /PRNewswire/ -- Original equipment manufacturers (OEMs) in the aerospace, medical, automotive and industrial sectors are confronted with the critical issue of shrinking ...
Samsung's next flip smartphone, the Galaxy Z Flip 8 is tipped to come powered by the newly launched Exynos 2600 processor.
ALPHARETTA, Ga., Jan. 9, 2024 /PRNewswire/ -- Flip Electronics and Ampleon have joined forces to extend the supply of Ampleon's LDMOS portfolio of high-performance RF transistors to customers ...
LONDON--(BUSINESS WIRE)--Technavio research analysts forecast the global flip chip packages market to grow at a CAGR of over 6% during the period 2018-2022. The integration of semiconductor components ...
Used to protect LCD interfaces from destructive electromagnetic fields and electrostatic discharges, the LX7207 flip-chip array can eliminate up to 50 discrete components. The 5 x 5 array can support ...
Karl J. Puttlitz Sr. and Paul A. Totta have won the 2008 IEEE Components, Packaging and Manufacturing Technology Award. They are being recognized for their pioneering role in the establishment of flip ...
Mod5 Series flip-top BGA socket requires no tooling or mounting holes, maximizing PCB real estate while reducing costs. For test, debug, and validation of 0.5-mm pitch BGA devices, the Mod5 Series ...
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