SANTA CLARA, Calif.--(BUSINESS WIRE)--The recently announced xMEMS XMC-2400 µCooling™ chip, the first-ever all-silicon, active micro-cooling air pump for small, thin electronics devices and ...

As our personal devices get smaller and are expected to do more stuff – whether that's your phone, a smartwatch, or a wearable AI assistant – they also tend to get hotter on the inside. That means it ...

AI data centers will start using xMEMS Labs’ tiny, all-silicon, active fan-on-a-chip cooling solution, µCooling, initially designed for smartphones and mobile devices. According to GamesBeat, this ...

As more devices get piled onto computer chips to increase processing power capacity, heat generation becomes increasingly concentrated. This heat must be removed to keep chip performance high, but is ...

In current designs, both the DRAM and the HPB sit on top of the processor. That means the HPB mainly helps cool the CPU and GPU, while the memory — which also heats up under load — doesn’t benefit as ...

Walk into a typical data center and one of the first things that jumps out at you is the noise—the low, buzzing sound of thousands of fans: fans next to individual computer chips, fans on the back ...

Engineering samples of xMEMS’ Sycamore and Cypress MEMS (micro-electromechanical systems) nearfield full bandwidth speaker chips, along with the company’s µCooling thermal management “air pump on a ...

Without cooling, data centres fall over. In November, a cooling system failure at a data centre in the US sent financial ...

Huawei has disclosed two new patents in China targeting advanced cooling solutions for AI chips, highlighting the rising urgency around thermal management as chip power consumption continues to climb.

Big technology companies have committed hundred of billions of dollars to build out data centers, mainly to process AI. The data centers represent economic opportunity for communities, but they are ...